IDS Engineer Stephen Barnes will be presenting at the upcoming FLEX 2026 Conference in Phoenix.
His talk, “Packaging Challenges Using Ultra-Fine Aerosol Printing for High Density Vertical Interconnects,” will highlight results from our recent collaboration with SEMI Americas FlexTech. In this project, NanoJet aerosol printing demonstrated sub-5-micron conductive trace deposition using commercially available inks—advancing capabilities for high-density interconnects and next-generation packaging.
We’re excited to share what ultra-fine aerosol printing is enabling in advanced electronics manufacturing.
If you’re attending FLEX 2026, we’d welcome the opportunity to connect.
https://flex2026.eventscribe.net/
